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NCP4561 Ultra Low-Noise Low Dropout Voltage Regulator with 1.0 V ON/OFF Control
The NCP4561 is a Low DropOut (LDO) regulator featuring excellent noise performances. Thanks to its innovative concept, the circuit reaches an incredible 40 mVRMS noise level without an external bypass capacitor. Housed in a small SOT-23 5 leads-like package, it represents the ideal designer's choice when space and noise are at premium. The absence of external bandgap capacitor unleashes the response time to a wake-up signal and makes it stay within 40 ms (in repetitive mode), pushing the NCP4561 as a natural candidate in portable applications. The NCP4561 also hosts a novel architecture which prevents excessive undershoots when the regulator is the seat of fast transient bursts, as in any bursting systems. Finally, with a static line regulation better than -75 dB, it naturally shields the downstream electronics against choppy lines.
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5 1 TSOP-5 SN SUFFIX CASE 483
PIN CONNECTIONS AND MARKING DIAGRAM
ON/OFF GND NC 1 P28YW 2 3 (Top View) P28 = Device Code Y = Year W = Work Week 5 Vin
* Ultra Low-Noise: 150 nV/Hz @ 100 Hz, 40 mVRMS 100 Hz - * * * * * * *
100 kHz Typical, Iout = 60 mA, Co = 1.0 mF Fast Response Time from OFF to ON: 40 ms Typical at a 200 Hz Repetition Rate Ready for 1.0 V Platforms: ON with a 900 mV High Level Nominal Output Current of 80 mA with a 100 mA Peak Capability Typical Dropout of 90 mV @ 30 mA, 160 mV @ 80 mA Ripple Rejection: 70 dB @ 1.0 kHz 1.5% Output Precision @ 25C Thermal Shutdown
4
Vout
Applications
* Noise Sensitive Circuits: VCOs RF Stages, etc. * Bursting Systems (TDMA Phones) * All Battery Operated Devices
ORDERING INFORMATION
Device NCP4561SN28T1 Voltage Output* 2.8 V Shipping 3000/Tape & Reel
ON/ OFF NC
1 3
On/Off Band Gap Reference
5 Thermal Shutdown
Vin
* Contact your ON Semiconductor sales representative for other output voltage values.
4 *Current Limit *Antisaturation Protection *Load Transient Improvement
Vout
GND
2
Figure 1. Simplified Block Diagram
(c) Semiconductor Components Industries, LLC, 2002
1
May, 2002 - Rev. 2
Publication Order Number: NCP4561/D
NCP4561
PIN FUNCTION DESCRIPTIONS
Pin # 1 2 3 4 5 Pin Name ON/OFF GND NC Vout Vin Function Shuts or wakes-up the IC The IC's ground None Delivers the output voltage Powers the IC It makes no arm to connect the pin to a known potential, like in a pin-to-pin replacement case. This pin requires a 1.0 mF output capacitor to be stable. A positive voltage up to 12 V can be applied upon this pin. Description A 900 mV level on this pin is sufficient to start the IC. A 150 mV shuts it down.
MAXIMUM RATINGS
Value Rating Power Supply Voltage ESD Capability, HBM Model ESD Capability, Machine Model Maximum Power Dissipation NW Suffix, Plastic Package Thermal Resistance Junction-to-Air Operating Ambient Temperature Maximum Junction Temperature (Note 1) Maximum Operating Junction Temperature (Note 2) Storage Temperature Range Pin # 5 All Pins All Pins PD RqJ-A TA TJmax TJ Tstg Symbol Vin Min - - - - - - - - - Max 12 1.0 200 Internally Limited 210 -40 to +85 150 125 -60 to +150 Unit V kV V W C/W C
C
ELECTRICAL CHARACTERISTICS
(For Typical Values TA = 25C, for Min/Max values TA = -40C to +85C, Max TJ = 125C unless otherwise noted) Characteristics Pin # Symbol Min Typ Max Unit
Logic Control Specifications
Input Voltage Range ON/OFF Input Resistance ON/OFF Control Voltages (Note 3) Logic Zero, OFF State, IO = 50 mA Logic One, ON State, IO = 50 mA 1 1 1 VON/OFF RON/OFF VON/OFF - 900 - - 150 - 0 - - 250 Vin - V kW mV
Currents Parameters
Current Consumption in OFF State OFF Mode Current: Vin = Vout + 1.0 V, IO = 0, VOFF = 150 mV Current Consumption in ON State ON Mode Current: Vin = Vout + 1.0 V, IO = 0, VON = 3.5 V Current Consumption in ON State, ON Mode Saturation Current: Vin = Vout - 0.5 V, No Output Load Current Limit Vin = Voutnom + 1.0 V, Output is brought to Voutnom - 0.3 V 1. Internally Limited by Shutdown. 2. Specifications are guaranteed below this value. 3. Voltage Slope should be Greater than 2.0 mV/ms. IQOFF IQON IQSAT IMAX - - - 100 0.1 180 800 180 2.0 - - - mA mA mA mA
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NCP4561
ELECTRICAL CHARACTERISTICS (continued)
(For Typical Values TA = 25C, for Min/Max values TA = -40C to +85C, Max TJ = 125C unless otherwise noted) Characteristics Pin # Symbol Min Typ Max Unit
Output Voltages
Vout + 1.0 V < Vin < 6.0 V, TA = 25C, 1.0 mA < Iout < 80 mA Vout + 1.0 V < Vin < 6.0 V, TA = -40C to +85C, 1.0 mA < Iout < 80 mA 4 4 Vout Vout 2.758 2.716 2.8 2.8 2.842 2.884 V V
Line and Load Regulation, Dropout Voltages
Line Regulation Vout + 1.0 V < Vin < 12 V, Iout = 80 mA Load Regulation Vin = Vout + 1.0 V, Cout = 1.0 mF, Iout = 1.0 to 80 mA Dropout Voltage (Note 4) Iout = 30 mA Iout = 60 mA Iout = 80 mA 4/5 4 Regline Regload - - - - 20 40 mV mV mV 4 4 4 Vin-Vout Vin-Vout Vin-Vout - - - 90 140 160 150 200 250
Dynamic Parameters
Ripple Rejection Vin = Vout + 1.0 V + 1.0 kHz 100 mVpp Sinusoidal Signal Output Noise Density @ 1.0 kHz RMS Output Noise Voltage Cout = 1.0 mF, Iout = 50 mA, F = 100 Hz to 1.0 MHz Output Rise Time Cout = 1.0 mF, Iout = 50 mA, 10% of Rising ON Signal to 90% of Nominal Vout 4/5 4 4 4 Noise trise Ripple - - - - -70 150 35 40 - - - - dB nV/ Hz mV ms
Thermal Shutdown
Thermal Shutdown 4. Vout is brought to Vout - 100 mV. - - 125 C
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NCP4561
DEFINITIONS
Load Regulation Line Regulation
The change in output voltage for a change in output current at a constant chip temperature.
Dropout Voltage
The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal value (which is measured at 1.0 V differential value). The dropout level is affected by the chip temperature, load current and minimum input supply requirements.
Output Noise Voltage
The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. One usually distinguishes static line regulation or DC line regulation (a DC step in the input voltage generates a corresponding step in the output voltage) from ripple rejection or audio susceptibility where the input is combined with a frequency generator to sweep from a few hertz up to a defined boundary while the output amplitude is monitored.
Thermal Protection
This is the integrated value of the output noise over a specified frequency range. Input voltage and output current are kept constant during the measurement. Results are expressed in mVRMS.
Maximum Power Dissipation
Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 125C, the regulator turns off. This feature is provided to prevent catastrophic failures from accidental overheating.
Maximum Package Power Dissipation
The maximum total dissipation for which the regulator will operate within its specs.
Quiescent Current
The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current.
The maximum power package power dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125C. Depending on the ambient temperature, it is possible to calculate the maximum power dissipation and thus the maximum available output current.
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NCP4561
TYPICAL CHARACTERISTICS
6.000 5.500 GROUND CURRENT (mA) 5.000 4.500 4.000 3.500 3.000 2.500 2.000 1.500 1.000 0.500 0.000 0 20 40 60 80 100 OUTPUT CURRENT (mA) 85C -40C 25C QUIESCENT CURRENT (mA) 205 210
200
195
190
185 -60
-40
-20
0
20
40
60
80
100
AMBIENT TEMPERATURE (C)
Figure 2. Ground Current vs. Output Current
Figure 3. Quiescent Current vs. Temperature
2.810 200 85C OUTPUT VOLTAGE (V) DROPOUT (mV) 150 25C 2.805 2.800 2.795 2.790 2.785 2.780 2.775 2.770 2.765 2.760 00 2.755 -20 40 60 80 100 0 20 40 60 80 100 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) -40C 25C 85C
100
-40C
50
Figure 4. Dropout vs. Output Current
Figure 5. Output Voltage vs. Output Current
OUTPUT NOISE SPECTRAL DENSITY
180 160 DROPOUT VOLTAGE (mV) 140 120 100 80 60 40 20 0 -60 -40 -20 0 20 40 60 80 100 30 mA 60 mA 80 mA
1000
Vin = Vout + 1 Cout = 1 mF IO = 10 & 50 mA
NOISE (nV/sqrt Hz)
100
10 RMS Noise 10 Hz to 100 kHz: 36 mV 10 Hz to 1 MHz: 47 mV 1 0.01 0.1 1 10 100 1000
TEMPERATURE (C)
FREQUENCY (kHz)
Figure 6. Dropout Voltage vs. Temperature
Figure 7. Typical Noise Density Performance
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NCP4561
POWER SUPPLY REJECTION RATIO Mag (dB) -7.50 -15.00 -22.50 PSSR (dB) -30.00 -37.50 -45.00 -52.50 -60.00 -67.50 10 100 1k 10 k 100 k 1M Vin = Vout + 1 Cout = 1 mF Iload = 10 mA
FREQUENCY (Hz)
Figure 8. Typical Ripple Rejection Performance (Iload = 10 mA)
POWER SUPPLY REJECTION RATIO Mag (dB) -7.50 -15.00 -22.50 PSSR (dB) -30.00 -37.50 -45.00 -52.50 -60.00 -67.50 10 100 1k 10 k 100 k 1M Vin = Vout + 1 Cout = 1 mF Iload = 60 mA
FREQUENCY (Hz)
Figure 9. Typical Ripple Rejection Performance (Iload = 60 mA)
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NCP4561
APPLICATION HINTS
Input Decoupling Protections
As with any regulator, it is necessary to reduce the dynamic impedance of the supply rail that feeds the component. A 1.0 mF capacitor either ceramic or tantalum is recommended and should be connected close to the NCP4561 package. Higher values will correspondingly improve the overall line transient response.
Output Decoupling
Thanks to a novel concept, the NCP4561 is a stable component and does not require any specific Equivalent Series Resistance (ESR) neither a minimum output current. Capacitors exhibiting ESRs ranging from a few mW up to 3.0 W can thus safely be used. The minimum decoupling value is 1.0 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices.
Noise Decoupling
The NCP4561 hosts several protections, giving natural ruggedness and reliability to the products implementing the component. The output current is internally limited to a maximum value of 180 mA typical while temperature shutdown occurs if the die heats up beyond 125C. These values let you assess the maximum differential voltage the device can sustain at a given output current before its protections come into play. The maximum dissipation the package can handle is given by:
T *T A P max + Jmax R qJA
If TJmax is limited to 125C, then the NCP4561 can dissipate up to 470 mW @ 25C. The power dissipated by the NCP4561 can be calculated from the following formula:
Ptot + V in I (I ) ) V * V out gnd out in I out
Unlike other LDOs, the NCP4561 is a true low-noise regulator. Without the need of an external bypass capacitor, it typically reaches the incredible level of 40 mVRMS overall noise between 100 Hz and 100 kHz. To give maximum insight on noise specifications, ON Semiconductor includes spectral density graphics. The classical bypass capacitor impacts the start-up phase of standard LDOs. However, thanks to its low-noise architecture, the NCP4561 operates without a bypass element and thus offers a typical 40 ms start-up phase.
or
Vin max + Ptot ) V out I gnd ) I out I out
If a 80 mA output current is needed, the ground current is extracted from the data-sheet curves: 4.0 mA @ 80 mA. For a NCP4561SN28T1 (2.8 V) delivering 80 mA and operating at 25C, the maximum input voltage will then be 8.3 V.
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NCP4561
Typical Applications
The following figure portrays the typical application of the NCP4561.
Dropout Charge
Input 5 SW* 4
Output
NCP4561 + C3 1.0 mF On/Off R1 100 k 1 2 3
+ C2 1.0 mF
*Enables the IC When Closed
Figure 10. A Typical Application Schematic PCB Layout Considerations
As for any low noise designs, particular care has to be taken when tackling Printed Circuit Board (PCB) layout. The figure below gives an example of a layout where stray
inductances/capacitances are minimized. This layout is the basis for the NCP4561 performance evaluation board. The BNC connectors give the user an easy and quick evaluation mean.
ON SEMICONDUCTOR NCP4561 EVALUATION BOARD
DROPOUT
+ OUT _
+ IN _
ON Semiconductor NCP4561 EVALUATION BOARD OFF ON
OUT
IN
ON/OFF
Figure 11. PCB Layout
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NCP4561
Understanding the Load Transient Improvement The NCP4561 features a novel architecture which allows the user to easily implement the regulator in burst systems where the time between two current shots is kept very small. The quality of the transient response time is related to many parameters, among which the closed-loop bandwidth with the corresponding phase margin plays an important role. However, other characteristics also come into play like the series pass transistor saturation. When a current perturbation suddenly appears on the output, e.g. a load increase, the error amplifier reacts and actively biases the PNP transistor. During this reaction time, the LDO is in open-loop and the output impedance is rather high. As a result, the voltage brutally drops until the error amplifier effectively closes the loop and corrects the output error. When the load disappears, the opposite phenomenon takes place with a positive overshoot. The problem appears when this overshoot decays down to the LDO steady-state value. During this decreasing phase, the LDO stops the PNP bias and one can consider the LDO asleep. If by misfortune a current shot appears, the reaction time is incredibly lengthened and a strong undershoot takes place. This reaction is clearly not acceptable for line sensitive devices, such as VCOs or other Radio-Frequency parts. This problem is dramatically exacerbated when the output current drops to zero rather than a few mA. In this later case, the internal feedback network is the only discharge path, accordingly lengthening the output voltage decay period. The NCP4561 cures this problem by implementing a clever design where the LDO detects the presence of the overshoot and forces the system to go back to steady-state as soon as possible, ready for the next shot, which positively improves the response time and decreases the negative peak voltage.
NCP4561 has a fast start-up phase Thanks to the lack of bypass capacitor the NCP4561 is able to supply its downstream circuitry as soon as the OFF to ON signal appears. In a standard LDO, the charging time of the external bypass capacitor hampers the response time. A simple solution consists in suppressing this bypass element but, unfortunately, the noise rises to an
Tek Run: 5.00 MS/s
unacceptable level. NCP4561 offers the best of both worlds since it no longer includes a bypass capacitor and starts in less than 40 ms typically (Repetitive at 200 Hz). It also ensures a low-noise level of 40 mVRMS 100 Hz-100 kHz. The following picture details the typical NCP4561 startup phase.
Sample Vout 500 mV/div C4 High 2.78 V C4 Mean 2.426 V
ON/OFF Pin Voltage 1 V/div
Ch3 1.00 V
Ch4 500 mV
M 10.0 ms Ch3
1.82 V
(Conditions: Vin = 3.8 V, Iload = 10 mA, Cout = 1 mF)
Figure 12. Start-Up Waveform
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NCP4561
TYPICAL TRANSIENT RESPONSES
Tek Run: 1.00 MS/s
Sample
Vout 200 mV/div
C4 Max 2.800 V C4 Mean 2.7840 V C4 Min 2.720 V
Iload 20 mA/div
Ch2 20.0 mVW M 50.0 ms Ch2 Ch4 200 mV (Conditions: Vin = 3.8 V, Cout = 1 mF)
38.4 mV
Figure 13. Load Current is Pulsed from 0 to 40 mA
Tek Run: 1.00 MS/s Vout 200 mV/div
Sample
C4 Max 2.844 V C4 Mean 2.7852 V C4 Min 2.708 V Iload 20 mA/div
Ch1 20.0 mVW Ch4 200 mV
M 50.0 ms Ch1
78.8 mV
(Conditions: Vin = 3.8 V, Cout = 1 mF)
Figure 14. Load Current is Pulsed from 0 to 80 mA
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NCP4561
TYPICAL TRANSIENT RESPONSES
Tek Run: 1.00 MS/s Sample
Vout 200 mV/div
C4 Max 2.824 V C4 Mean 2.7848 V C4 Mean 2.776 V
Iload 20 mA/div
Ch2 20.0 mVW M 50.0 ms Ch2 Ch4 200 mV (Conditions: Vin = 3.8 V, Cout = 1 mF)
38.4 mV
Figure 15. Load Current is Switched from 40 to 0 mA
Tek Stop: 1.00 MS/s
1930 Acgs Vout 200 mV/div C4 Max 2.844 V C4 Mean 2.7848 V C4 Min 2.708 V Iload 20 mA/div
Ch1 20.0 mVW Ch4 200 mV
M 50.0 ms Ch1
0V
(Conditions: Vin = 3.8 V, Cout = 1 mF)
Figure 16. Load Current is Switched from 80 to 0 mA
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NCP4561
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection
0.094 2.4
interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.037 0.95 0.074 1.9 0.037 0.95 0.028 0.7 0.039 1.0 inches mm
TSOP-5
(TSOP-5 is footprint compatible with SOT23-5)
ORDERING INFORMATION
Device NCP4561SN28T1 Voltage Output* 2.8 V Package TSOP-5 Shipping 3000 Units /Tape & Reel
*Contact your ON Semiconductor sales representative for other output voltage values.
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NCP4561
PACKAGE DIMENSIONS
TSOP-5 SN SUFFIX PLASTIC PACKAGE CASE 483-01 ISSUE B
D
5 1 2 4 3
S
B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A B C D G H J K L M S MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0_ 10 _ 0.0985 0.1181
L G A J C 0.05 (0.002) H K M
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NCP4561
Notes
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Notes
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NCP4561
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
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NCP4561/D

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